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首页> 美国政府科技报告 >Optical Interconnect Technology (OIT) Multichip Module to Multichip Module
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Optical Interconnect Technology (OIT) Multichip Module to Multichip Module

机译：光学互连技术（OIT）多芯片模块到多芯片模块

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We have successfully demonstrated the first MCM-to-board-to-MCM optical interconnect based on VCSELs, polymer waveguide, and MCM-C packaging technologies. We demonstrated low-cost component fabrication and passive assembling techniques that are compatible with existing electronic manufacturing processes. We believe these approaches are critical to optical insertion into real system applications. We fabricated flexible polymer waveguide ribbons, board-integrated optical waveguides, and passively aligned flex-to-board waveguide connectors. We also demonstrated optical links based on conventional MCM-C packages with multiple data channels at data rates up to 1 Gbps per channel.

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