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首页> 外文会议>2014 International Symposium on Optomechatronic Technologies >Measurement of In-Plane Strain with Shearography and Electronic Speckle Pattern Interferometry for Composite Materials
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Measurement of In-Plane Strain with Shearography and Electronic Speckle Pattern Interferometry for Composite Materials

机译：剪切和电子散斑图案干涉法测量复合材料的平面应变

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摘要

Experimental results obtained by applying both technique, Electronic Speckle Pattern Interferometry (ESPI) and Electronic Speckle Pattern Shearing Interferometry (ESPSI) were compared in the study of composite materials. We found that the difference between the strain fields obtained by ESPSI and ESPI was roughly a constant. This result was expected since, although ESPI in turn allows computing absolute strain values, the strains measured by ESPSI are relative to a reference that must be measured by an additional method.
机译：在复合材料的研究中，比较了通过应用电子散斑图案干涉法（ESPI）和电子散斑图案剪切干涉法（ESPSI）两种技术获得的实验结果。我们发现，通过ESPSI和ESPI获得的应变场之间的差异大致恒定。由于尽管ESPI允许计算绝对应变值，但通过ESPSI测量的应变相对于必须通过其他方法测量的参考值，因此可以得到此结果。

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