Research on reliability of Sn-1.0Ag-0.5Cu low-Ag lead-free solder alloy

机译：Sn-1.0Ag-0.5Cu低银无铅焊料合金的可靠性研究

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The main objective of this paper is to investigate the reliability of Sn-1.0Ag-0.5Cu low-Ag lead-free solder alloy. The wettability, mechanical property and microstructure of Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. Experimental studies have shown that the wetting property of low-Ag lead-free solder alloy SAC105 remains to be improved and mechanical strength is lower to SAC305, but its anti-drop and anti-shock performance are outstanding. Though the wetting property of SAC105 is inferior to SAC305, the melting point and wettability of SAC105 can meet the actual reliability requirements of products. Matched with appropriate process, low-Ag lead-free solder can also form reliable solder joints to meet the reliability standards in industrial production.

机译：本文的主要目的是研究Sn-1.0Ag-0.5Cu低银无铅焊料合金的可靠性。比较研究了Sn-1.0Ag-0.5Cu（SAC105）和Sn-3.0Ag-0.5Cu（SAC305）无铅焊料合金的润湿性，力学性能和显微组织。实验研究表明，低银无铅焊料合金SAC105的润湿性有待提高，机械强度低于SAC305，但其抗跌落和抗冲击性能突出。尽管SAC105的润湿性不如SAC305，但其熔点和润湿性仍可以满足产品的实际可靠性要求。配合适当的工艺，低银无铅焊料还可形成可靠的焊点，以满足工业生产中的可靠性标准。

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来源
《2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy》|2014年|401-404|共4页
会议地点 State College PA(US)
作者
Hu Yating; An Bing; Chen Rong; Lv Weiwen; Wu Yiping;
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作者单位

School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China;

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会议组织
原文格式 PDF
正文语种 eng
中图分类
关键词
Lead; Mechanical factors; Microstructure; Reliability; Soldering; Standards; SAC105; lead-free solder; low-Ag; reliability;

机译：铅;机械因素；微观结构可靠性;焊接;标准； SAC105；无铅焊料；低银可靠性;;

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2. A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints [J] . Dhafer Abdul Ameer Shnawah, Mohd Faizul Bin Mohd Sabri, Irfan Anjum Badruddin Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2012,第1期

机译：微量合金元素对低银Sn-Ag-Cu焊点热循环和跌落冲击可靠性的影响
3. Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature [J] . Gan Gui-Sheng, Gan Lin-Qiao, Guo Ji-Zhao, Materials transactions . 2018,第3期

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4. Research on reliability of Sn-1.0Ag-0.5Cu low-Ag lead-free solder alloy [C] . Hu Yating, An Bing, Chen Rong, Joint IEEE International Symposium on the Applications of Ferroelectrics . 2014

机译：SN-1.0AG-0.5CU低AG无铅焊料合金可靠性研究
5. Characterization of Low Melting Temperature, Low-Ag, Bi-Containing, Pb-Free Solder Alloys [D] . Kosiba, Eva. 2016

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6. Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) system [O] . Michael Hindler, Zhongnan Guo, Adolf Mikula -1

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7. Preparation of Lead-free Composite Powder Solder Paste and Study on Reliability of Lead-free Solder Joint [O] . 王建 2012

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Research on reliability of Sn-1.0Ag-0.5Cu low-Ag lead-free solder alloy

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