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首页> 外文会议>2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy >Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature
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Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature

机译：低温下锡基焊点的力学性能和微观结构

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摘要

This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints' mechanical properties, failure modes and failure mechanisms The results show that tensile strength of the solder joints increases first and then decreases along with the decreasing temperature, 63Sn37Pb/Cu and 62Sn36Pb2Ag/Ag joints reach their maximum strength at 173K and 223K respectively. Cryogenic temperature storage has no effect on IMC growing, but tin whisker is found in some parts of 63Sn37Pb/Cu and 62Sn36Pb2Ag/Cu solder joints stored for 10 days, without appearance in solder joints that stored for 20 days and those lead-free solder jonits. Sn whisker is random and unpredictable.
机译：这项工作是针对焊点的低温机械性能而设计的，温度为293K，223K，173K和123K，以便获得低温下的机械强度和断裂机理。利用低温（77K）储存实验获得了内部焊点的微观结构，IMC等微观组织的演变以及焊点的力学性能，破坏模式和破坏机理。结果表明，焊点的抗拉强度63Sn37Pb / Cu和62Sn36Pb2Ag / Ag接头在173K和223K处分别达到最大强度，然后随着温度的降低而先增大然后减小。低温温度存储对IMC的生长没有影响，但是在存储10天的63Sn37Pb / Cu和62Sn36Pb2Ag / Cu焊点的某些部分中发现了锡晶须，而在存储20天的焊点和无铅焊点中没有出现锡晶须。锡晶须是随机且不可预测的。

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