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首页> 外文会议>2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy >Whisker growth in the crack region of the cathode interface during current stressing process in lead-free solder joints
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Whisker growth in the crack region of the cathode interface during current stressing process in lead-free solder joints

机译：无铅焊点在电流应力过程中阴极界面裂纹区域中的晶须生长

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摘要

Whisker formation mechanism has been widely investigated for recent decades since its great influence on degrading the reliability of the electronic devices. In our work, effect of current stressing on whisker growth in Cu/Sn3.8Ag0.7Cu/Cu and Cu/Sn58Bi/Cu solder joints was investigated. Results show that after current stressing for a long time, many whiskers are observed in some local regions at the cathode interface. What is most important thing is that the whisker growth occurred at the cathode interface in the crack region. These whiskers are all with filament-type morphology, and no column-type is formed. In general, they can reach beyond 10μm in length. EDX reveals that these whiskers are mixtures of Sn and Bi for Sn58Bi solder and single Sn crystal for Sn3.8Ag0.7Cu solder. However, as the stressing time increases, the whiskers seem to stop growing any more. In conclusion, this filament-type whisker growth at the cathode interface may be responsible for the current density accumulation at the crack region, leading to much Joule heat aggregation that triggers the whisker formation.
机译：由于晶须形成机制对降低电子设备的可靠性有很大的影响，因此近几十年来人们对其进行了广泛的研究。在我们的工作中，研究了电流应力对Cu / Sn3.8Ag0.7Cu / Cu和Cu / Sn58Bi / Cu焊点中晶须生长的影响。结果表明，在长时间施加电流应力后，在阴极界面的某些局部区域观察到许多晶须。最重要的是晶须生长发生在裂纹区域的阴极界面处。这些晶须均具有丝状形态，并且没有形成柱状。通常，它们的长度可以超过10μm。 EDX显示，这些晶须是Sn58Bi焊料的Sn和Bi的混合物，而Sn3.8Ag0.7Cu焊料是单Sn晶体的混合物。但是，随着压力时间的增加，晶须似乎不再增长。总之，这种在阴极界面处的细丝型晶须生长可能是造成裂纹区域电流密度累积的原因，导致许多焦耳热聚集，从而触发了晶须的形成。

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