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首页> 美国卫生研究院文献>Scientific Reports >Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena mechanism and prevention
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Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena mechanism and prevention

机译：超声波辅助钎焊在Mg / Sn基钎料/ Mg接头中快速形成和生长高密度锡晶须：现象机理和预防方法

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摘要

A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.
机译：通过在250 C的温度下使用超声波辅助焊接制造Mg / Sn基焊料/ Mg接头，并在250°C的温度下进行6µs，然后进行热老化，从而开发了一种通用的促进高密度锡晶须在焊料上快速形成和生长的方法。在25°C下7 d。结果表明，超声辅助钎焊可导致镁在液态锡中的过饱和溶解，并在凝固后导致锡中存在两种形式的镁。而且，由于固态Sn中两种Mg形式的特殊作用，促进了高密度晶须的形成和生长。具体而言，间隙Mg可以为Sn晶须的生长提供持续的驱动力，而Mg2Sn相可以增加Sn晶须的形成可能性。另外，我们提出了少量添加锌（≥3wt。％）可以显着限制锡基焊锡中锡晶须的形成和生长，并且其预防机制归因于锌原子的偏析在晶界或相界处，并在焊料中形成层状富锌结构。

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