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首页> 外文会议>2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices amp; Workshop on Piezoresponse Force Microscopy >Study of key failure modes of PTH in high density printed board and case study
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Study of key failure modes of PTH in high density printed board and case study

机译：高密度印制板中PTH关键失效模式的研究与案例研究

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摘要

Over the last several decades, the multilayer printed boards, especially the high density substrates, have been widely used in electrical industry. Generally the different layers of printed boards are interconnected by the plated-through holes (PTH) and buried/blind vias. The quality and reliability of PTH significantly affect the reliability of printed boards, even the performance of the whole electrical system. So the research of quality, reliability and failure analysis to the PTH is important to make products reliable and to maintain its performance under different loads. The purpose of the paper is to introduce the methods of quality control of PTH and the key failure modes of PTH in high density printed board. The key failure modes of PTH such as plating voids, plating crack and conductive anodic filament (CAF) were presented. At the same time, several typical PTH failure cases were used to show how the failure occurred. We also investigated the failure mechanisms and found the root causes by using some conventional methods of failure analysis such as metallography microscope inspection and SEM&EDS analysis. The plating crack is mainly driven by the mismatch between the different material properties, such as coefficient of thermal expansion (CTE), hygro-swelling and vapor pressure induced expansion. For CAF failure, the mechanism is an electrochemical transport of ions across an electrical potential between anode and cathode. This paper also introduced an accelerated evaluation method to identify the CAF failure. Finally, for reliability improvement, several suggestions were given to prevent the PTH failure.
机译：在过去的几十年中，多层印刷电路板，尤其是高密度基板，已广泛用于电气工业。通常，印刷板的不同层通过镀通孔（PTH）和掩埋/盲孔互连。 PTH的质量和可靠性会显着影响印制板的可靠性，甚至会影响整个电气系统的性能。因此，对PTH进行质量，可靠性和故障分析的研究对于使产品可靠并在不同负载下保持其性能至关重要。本文的目的是介绍高密度印制板中PTH的质量控制方法和PTH的关键失效模式。提出了PTH的关键失效模式，如镀层孔隙，镀层裂纹和导电阳极丝（CAF）。同时，使用了几种典型的PTH故障案例来说明故障是如何发生的。我们还研究了故障机理，并通过一些常规的故障分析方法（如金相显微镜检查和SEM＆EDS分析）找到了根本原因。电镀裂纹主要是由不同材料特性之间的不匹配所驱动的，例如热膨胀系数（CTE），湿膨胀和蒸汽压引起的膨胀。对于CAF失效，其机制是离子在阳极和阴极之间的电势上进行电化学迁移。本文还介绍了一种识别CAF故障的加速评估方法。最后，为了提高可靠性，提出了一些防止PTH失效的建议。

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