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首页> 外文会议>2016 COES annual conference proceedings >Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging
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Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

机译：电力电子包装用高温高分子密封胶的研究

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摘要

Semiconductor encapsulation is crucial to electronicrnpackaging because it provides protection against mechanicalrnstress, electrical breakdown, chemical erosions, α radiations,rnand so on. Conventional encapsulants are only applicable belowrn150 °C. However, with increasing demand for high-density andrnhigh-temperature packaging, encapsulants that are functional atrnor above 250 °C are required. In this paper, five types of encapsulants,rnincluding conformal coatings, underfills, molding compounds,rnpotting compounds, and glob tops, are surveyed. First,rnrecommended properties and selection criteria of each type ofrnencapsulant are listed. Second, standard test methods for severalrncrucial properties, including glass-transition temperature (Tg),rncoefficient of thermal expansion (CTE), dielectric strength, andrnso on are reviewed. Afterward, commercial products with highoperationrntemperature are surveyed. However, the results of thernsurvey reveal a lack of high-temperature encapsulants. Therefore,rnthis paper reviews recent progress in achieving encapsulants withrnboth high-temperature capability and satisfactory properties.rnMaterial compositions other than epoxy, such as polyimide (PI),rnbismaleimide (BMI), and cyanate ester (CE), are potential encapsulantsrnfor high-temperature (250 °C) operation, although theirrnCTE needs to be tailored to limit internal stress. Fillers arernreported to be efficient in reducing the CTE. In addition, fillersrnmay also have a beneficial impact on the thermal stability ofrnsilicone-based encapsulants, whose high-temperature capabilityrnis limited by their thermal instability.
机译：半导体封装对于电子包装至关重要，因为它可以防止机械应力，电击穿，化学腐蚀，α辐射等。常规密封剂仅在150°C以下适用。但是，随着对高密度和高温包装的需求不断增加，需要在250°C或更高温度下具有功能的密封剂。本文研究了五种类型的密封剂，包括保形涂料，底部填充剂，模塑料，灌封剂和球形顶部。首先，列出每种类型的密封胶的推荐性能和选择标准。其次，回顾了几种关键性能的标准测试方法，包括玻璃化转变温度（Tg），热膨胀系数（CTE），介电强度等。之后，对高温运行的商品进行了调查。但是，测量结果表明缺少高温密封剂。因此，本文综述了在获得既具有高温性能又具有令人满意的性能的密封剂方面的最新进展。rn除环氧树脂以外的材料成分，例如聚酰亚胺（PI），双马来酰亚胺（BMI）和氰酸酯（CE），是用于高温的潜在密封剂（250°C）操作，尽管需要调整其CTE以限制内部应力。据报道，填料有效降低了CTE。另外，填充剂还可能对基于硅氧烷的密封剂的热稳定性产生有益的影响，其高温能力受到其热不稳定性的限制。

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  • 来源
  • 会议地点 Blacksburg VA(US)
  • 作者

    Yiying Yao; Guo-Quan Lu; Dushan Boroyevich; Khai D. T. Ngo;

  • 作者单位

    Center of Power Electronics Systems,Department of Materials Science and Engineering, Virginia PolytechnicInstitute and State University, Blacksburg, VA 24061 USA e-mail:yiyingy@vt.edu;

    Center of Power Electronics Systems,Department of Materials Science and Engineering, Virginia PolytechnicInstitute and State University, Blacksburg, VA 24061 USA gqlu@vt.edu;

    Center of PowerElectronics Systems, Department of Electrical and Computer Engineering,Virginia Polytechnic Institute and State University, Blacksburg, VA 24061USA e-mail: dushan@vt.edu;

    Center of PowerElectronics Systems, Department of Electrical and Computer Engineering,Virginia Polytechnic Institute and State University, Blacksburg, VA 24061USA kdtn@vt.edu;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Encapsulant; high-temperature; plastic integrated circuit packaging; power electronic packaging; semiconductor device packaging;

    机译：密封剂;高温;塑料集成电路包装;电力电子包装;半导体器件包装;

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