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首页> 外文会议>2016 IEEE 37th International Electronics Manufacturing Technology amp; 18th Electronics Materials and Packaging Conference >Cost savings through innovative and LEAN engineering approach for wireless modules
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Cost savings through innovative and LEAN engineering approach for wireless modules

机译：通过创新和精益的无线模块工程方法节省成本

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One of the wireless module required additional Thermal Interface Material (TIM) and Electro Magnetic Interference (EMI) absorber in order for the product to function per requirement. In order to place these two items onto the module, the one piece shield will need to be replaced by 2 pieces shield - shield fence & shield lid. All these additional BOM items will need to be assembled and inspected manually by operators. This resulted in significant increase of cycle time needed for the assembly and inspection process which causes ODM to increase their Manufacturing Value Adder (MVA). Total BOM cost also increased significantly for those three additional items. As the results, Instead of achieving generation product cost reduction, the cost for that generation of wireless products actually went up. This presentation will illustrate the key challenges faced and the approach that we have taken mainly through Process Automation, LEAN waste elimination and Process Shift Left to supplier. These innovative and holistic three phases approach enable huge cycle time reduction (91%) for the additional processes in ODM and achieve significant cost savings across the life cycle of the product.
机译：无线模块之一需要附加的热接口材料（TIM）和电磁干扰（EMI）吸收器，才能使产品按要求工作。为了将这两项放置在模块上，需要将一件式的防护罩替换为两片式的防护罩-防护罩和防护罩。所有这些其他BOM表项目都需要由操作员手动组装和检查。这导致装配和检查过程所需的周期时间显着增加，这导致ODM增加了其制造附加值（MVA）。这三个附加项目的BOM总成本也显着增加。结果，代替了降低一代产品的成本，该代无线产品的成本实际上上升了。本演讲将说明面临的主要挑战以及我们主要通过过程自动化，LEAN废物消除和向供应商转移过程所采取的方法。这些创新的整体性三阶段方法可为ODM中的其他流程大幅减少周期时间（91％），并在产品的整个生命周期中节省大量成本。

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