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首页> 外文会议>2016 IEEE 37th International Electronics Manufacturing Technology amp; 18th Electronics Materials and Packaging Conference >An investigation on micro-via drilling on ceramic substrates by a picosecond laser
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An investigation on micro-via drilling on ceramic substrates by a picosecond laser

机译：皮秒激光在陶瓷基板上进行微孔钻孔的研究

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摘要

Special ceramics are getting more attention as substrate materials for IC packaging, LED packaging and PC board. Certain ceramic materials have high mechanical strength, low thermal expansion, high electric barrier and high thermal conductivity. These properties are idea for devices pf designated purpose such as high power IC, LED and fast communication IC. For these applications via holes for signal and power connection are necessary. As the devices are miniaturized the sizes of via holes are forced to be reduced even down to tens of micrometers, thus, the drilling task can only be performed by laser. However, the ceramics are brittle and during the laser machining process the thermal stress and shock may easily cause defect in the heat affected zone. Also the debris generated in the thermal fusion-solidation process deteriorate the integrity of the via hole such as the in-out diameter, taper angle and roughness around the via. There is a trade-off between machining efficiency and quality has to be tuned. In this paper we apply a 12 picosecond 1033 nm wavelength laser to study the photo material interaction for drilling micro via in three thin plates of AlN, Al2O3 and Fe2O3 ceramic. AlN and Al2O3 are good heat dissipation material and Fe2O3 is idea for electronic noise immunity. A detail report of the results including machining parameters and inspection of via holes will be presented.
机译：特殊陶瓷作为IC封装，LED封装和PC板的基材越来越受到关注。某些陶瓷材料具有高机械强度，低热膨胀，高电势垒和高导热率。这些特性是针对指定用途的设备（例如大功率IC，LED和快速通信IC）的想法。对于这些应用，需要用于信号和电源连接的通孔。随着装置的小型化，迫使通孔的尺寸减小到甚至几十微米，因此，只能通过激光来执行钻孔任务。但是，陶瓷很脆，在激光加工过程中，热应力和冲击很容易在热影响区造成缺陷。而且，在热熔凝处理中产生的碎屑也会破坏通孔的完整性，例如进出直径，锥角和通孔周围的粗糙度。在加工效率和质量之间必须进行权衡。在本文中，我们使用12皮秒1033 nm波长的激光来研究在AlN，Al2O3和Fe2O3陶瓷三块薄板上钻微孔的光敏材料相互作用。 AlN和Al2O3是良好的散热材料，Fe2O3是抗电子噪声的想法。将提供结果的详细报告，包括加工参数和通孔检查。

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