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Localized Heating in Mo'I'ei-Based Resistive Memory Devices

机译:基于Mo'I'ei的电阻存储设备中的局部加热

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Layered materials like transition metal dichalcogenides (TMDs) and hexagonal boron nitride (h-BN) have been recently demonstrated as the switching layers in resistive random access memory (RRAM) devices [1]–[3], but their switching mechanisms are not yet well understood. In this work, we show resistive memory switching in MoTe2 devices and investigate the thermal origins of their switching behavior using scanning thermal microscopy (SThM). We observe localized heating due to the formation of a conductive plug, which is correlated with electro-thermal simulations, providing the first thermal insights into the operation of such RRAM devices.
机译:层状材料,如过渡金属二硫化碳(TMDs)和六方氮化硼(h-BN),最近已被证明是电阻随机存取存储器(RRAM)设备中的开关层[1] – [3],但它们的开关机制尚未出现非常明白。在这项工作中,我们展示了MoTe2器件中的电阻式存储器开关,并使用扫描热显微镜(SThM)研究了其开关行为的热起源。由于导电插头的形成,我们观察到局部加热,这与电热模拟相关,从而为此类RRAM器件的运行提供了初步的热学见解。

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