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首页> 外文会议>22nd Annual Semiconductor Pure Water and Chemicals Conference Feb 17-19, 2003 Santa Clara, CA >Obtaining Greater Process Control While Minimizing Particle Contamination
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Obtaining Greater Process Control While Minimizing Particle Contamination

机译：在减少颗粒污染的同时获得更好的过程控制

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摘要

Accurately controlling liquid flow is critical for attaining high process yields in wet cleaning and etch processes, chemical mechanical polishing (CMP), and on-demand chemical blending applications. To maintain high chemical purity, a flow control technology must not generate particles to the fluid stream. This paper will present laboratory data to demonstrate the low levels of particle generation associated with the use of a differential pressure (DP) based flow controller. A DP-based flow measurement technology allows this device to measure liquid flow and pressure without the use of moving parts, a proven particulate generation source. The flow controller performs closed loop control using flow and pressure measurement, and is used for in-situ monitoring, control and materials integrity management of a process liquid flow rate. The flow controller's valve technology provides control without adding particles to the fluid stream during actuation. The controller's valve seat and diaphragm are designed to minimize dead volume and fluid shear, reducing the possibility of process contamination. Also, to avoid excessive movement, the valve diaphragm actuation stroke is minimized. Testing was completed under three different conditions that represent probable use cases of the device. Multiple particle counters were used to insure test accuracy. Test results indicate low levels of particle generation during flushing and normal operation of the device. The test data indicates that no particle generation is produced above the background level of the process fluid, confirming that semiconductor equipment users can use the flow controller for transporting critical materials sensitive to particle generation. This provides users with another tool for managing materials integrity.
机译：在湿法清洁和蚀刻工艺，化学机械抛光（CMP）和按需化学混合应用中，准确控制液体流量对于获得高工艺产量至关重要。为了保持高化学纯度，流量控制技术一定不能在流体流中产生颗粒。本文将介绍实验室数据，以证明与基于差压（DP）的流量控制器的使用相关的微粒产生水平较低。基于DP的流量测量技术使该设备无需使用经过验证的颗粒生成源活动部件即可测量液体流量和压力。流量控制器使用流量和压力测量执行闭环控制，并用于现场监控，控制和控制处理液流速的材料完整性。流量控制器的阀技术可在致动过程中提供控制，而不会在流体流中添加颗粒。控制器的阀座和隔膜设计为最大程度地减少死体积和流体剪切，从而减少了过程污染的可能性。另外，为了避免过度运动，将阀膜的致动行程最小化。测试在代表设备可能使用情况的三种不同条件下完成。使用多个粒子计数器以确保测试准确性。测试结果表明在设备冲洗和正常运行过程中产生的颗粒物很少。测试数据表明，在过程流体的本底液位以上不会产生颗粒，这证明半导体设备用户可以使用流量控制器来传输对颗粒产生敏感的关键材料。这为用户提供了另一个用于管理材料完整性的工具。

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