Advanced Micromachining Processes for Micro-opto-electro- mechanical Components and Devices

机译：微光机电元件和设备的先进微加工工艺

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We show that a more comprehensive understanding of Si electrochemical etching procedures allows to improve significantly the reliability and selectivity of the etching processes traditionally used in micromachining. In particular we develop a novel procedure, based on the selective electrochemical formation of porous Si, that can be used to fabricate not only low cost SOI structures, but also Si cantilevers and buried channels and to perform the smart cut of pre-existing structures. We demonstrate that this procedure is fully suitable for both surface and bulk micro-machining processes.

机译：我们表明，对Si电化学蚀刻程序的更全面的了解可以显着提高传统上用于微加工的蚀刻工艺的可靠性和选择性。特别是，我们基于多孔硅的选择性电化学形成，开发了一种新颖的方法，该方法不仅可用于制造低成本的SOI结构，而且可用于制造Si悬臂和掩埋通道，并执行现有结构的智能切割。我们证明了该程序完全适用于表面和整体微细加工过程。

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来源
《2nd International EUSPEN Conference on Precision Engineering Nanotechnology Vol.1, May 27th-31st, 2001, Turin, Italy》|2001年|p.24-27|共4页
会议地点 Turin(IT)
作者
G. DArrigo; S. Castorina; S. Coffa; C. Spinella;
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作者单位

CNR-IMETEM, Catania, Italy;

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原文格式 PDF
正文语种 eng
中图分类机械、仪表工业;
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2. Surface Micromachined Micro-Opto-Electro- Mechanical Systems [J] . Victor M. BRIGHT, John H. COMTOIS, J. Robert REID, IEICE Transactions on Electronics . 1997,第2期

机译：表面微加工微光机电系统
3. Integrated electroplated micromachined magnetic devices using low temperature fabrication processes [J] . Jae Yeong Park, Allen M.G. IEEE transactions on electronics packaging manufacturing . 2000,第1期

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5. Packaging-compatible micromachined magnetic devices: Integrated passive components and modules. [D] . Park, Jae Yeong. 1997

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Advanced Micromachining Processes for Micro-opto-electro- mechanical Components and Devices

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