首页> 外文会议>2nd International EUSPEN Conference on Precision Engineering Nanotechnology Vol.1, May 27th-31st, 2001, Turin, Italy >Adhesion Problems during Handling of Micro Parts -Vibration Assisted Release of Objects
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Adhesion Problems during Handling of Micro Parts -Vibration Assisted Release of Objects

机译:微型零件处理过程中的附着力问题-振动辅助释放物体

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摘要

The correct assembly of micro systems can become impossible when adhesion appears between a micro part and the gripper. In this case the micro part will stick to the gripper, thus disturbing an automatic assembly process. Important reasons for this undesirable adhesion are electrostatic forces, intermolecular forces (e.g. van-der-Waals), liquid bridge forces, and mechanical clamping. This paper reports on the effects of these forces on the handling of micro parts, and on strategies to avoid or overcome adhesion forces.
机译:当在微型零件和夹具之间出现粘附力时,微型系统的正确组装将变得不可能。在这种情况下,微型零件会粘在夹具上,从而干扰自动组装过程。产生这种不良粘附力的重要原因是静电力,分子间力(例如van-der-Waals),液桥力和机械夹持。本文报告了这些力对微零件处理的影响,以及避免或克服粘附力的策略。

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