The Application of Laser Technology to Interconnect Processes

机译：激光技术在互连过程中的应用

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Lasers of various types are in use for wire stripping and wire marking. Wire stripping technology includes stripping with CO_2 lasers, scribing of coax shields with YAG lasers and special fiber optic applications using Excimer lasers. Plasma systems are in use for wires used in medical applications. New wire marking technology uses Excimer and solid-state harmonic systems for indelible and non-damaging alphanumeric and bar code marking of a range of wire types. An explanation of the processes and the laser application solutions is presented.

机译：各种类型的激光器用于剥线和标记。剥线技术包括使用CO_2激光器进行剥线，使用YAG激光器对同轴电缆屏蔽层进行划刻以及使用准分子激光器进行的特殊光纤应用。等离子系统用于医疗应用中的电线。新的导线标记技术使用准分子和固态谐波系统对各种导线类型进行了不可磨灭和无损的字母数字和条形码标记。介绍了工艺和激光应用解决方案。

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《35th Annual IICIT Connector and Interconnection Technology Symposium and Trade Show; Oct 7-9, 2002; Orlando, Florida》|2002年|p.173-176|共4页
会议地点 Orlando FL(US);Orlando FL(US)
作者
Charles C. Carney;
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作者单位

Spectrum Interconnect Incorporated;

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会议组织
原文格式 PDF
正文语种 eng
中图分类电工技术;
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The Application of Laser Technology to Interconnect Processes

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