To meet new intelligent power application requirements in the automotive electronics, a multichip power package platform has been developed at Motorola's Interconnect Systems Laboratory Europe (ISL-E) in Munich, Germany. The developed package platform offers two customer interfaces, a leaded standard SMT multichip power package and a mechatronic solution. This communication presents the concept and performance of the leaded, molded multichip power package, which can accommodate 2-5 logic and power devices and several passive components. The devices are interconnected on a common high thermal conductive, insulated metal substrate (IMS) utilizing flip chip die attach technology. The main features of the assembly process include leadframe solder attach on heatsink, flip chip die attach and overmolding. For high thermal conductivity the heatsink is exposed on the bottom of the package. The presented power package shows excellent heat dissipation performance and consistently passes automotive reliability criteria.
展开▼
