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首页> 外文会议>37~(th) IMAPS Nordic Annual Conference 10-13 September 2000 Helsingor, Denmark >Development of True Printed Circuits Using Active Metallurge Conductive Ink
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Development of True Printed Circuits Using Active Metallurge Conductive Ink

机译：使用有源Metallurge导电油墨开发真正的印刷电路

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摘要

The advantages of being able to screen print circuits on ceramic materials have long been known and now a material exists that allows solderable conductors to be printed and 'fired' on organic substrates such as FR4. The material is highly environmentally friendly eliminating the need for conventional subtractive processing and its associated environmentally unfriendly effluent. The amount of lead in the final product is also greatly reduced and in some cases eliminated entirely. Processing of the material is also simple with only a screen printer, oven and reflow system required. The material described in the paper forms an adhesive joint to the board surface and a true metallurgical joint to any solderable surface e.g. components or existing copper tracks thus allowing its use not only as a circuitisation material but also as a conductive adhesive. The internal continuous metal structure results in very high conductivity and power handling capability. The paper will describe the structure and chemistry of the material including the breakthrough, which enables high adhesion and excellent solderability in the same material. The paper will further describe how it is now possible to produce circuits and attach components with only one 'reflow' operation. The use of the material in the build up of multilayer boards and the possibility to co-fire several layers will also be discussed. Finally, reliability data showing how the material is relatively unaffected by standard environmental stress regimes and conforms to industry and Bellcore standards for surface contamination, electromigration and surface insulation resistance.
机译：能够在陶瓷材料上丝网印刷电路的优点早已为人所知，现在已经存在一种可将可焊导体印刷并“烧制”在有机基材（例如FR4）上的材料。该材料是高度环保的，消除了对常规减法工艺及其相关的对环境不利的废水的需要。最终产品中的铅含量也大大减少，在某些情况下甚至完全消除了。仅需丝网印刷机，烤箱和回流系统，材料的处理也很简单。纸中所述的材料形成了到板表面的粘合剂连接，并且形成了到任何可焊接表面（例如金属表面）的真正的冶金连接。因此，它不仅可以用作电路材料，还可以用作导电粘合剂。内部连续的金属结构导致很高的电导率和功率处理能力。本文将介绍包括突破在内的材料的结构和化学性质，这将使同一种材料具有很高的附着力和出色的可焊性。本文将进一步描述现在如何仅通过一次“回流”操作就可以生产电路和连接元件。还将讨论该材料在多层板中的使用以及共烧几层的可能性。最后，可靠性数据显示了该材料如何相对不受标准环境应力条件的影响，并符合有关表面污染，电迁移和表面绝缘电阻的行业和Bellcore标准。

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