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首页> 外文会议>37~(th) IMAPS Nordic Annual Conference 10-13 September 2000 Helsingor, Denmark >A Wafer Level Chip Size Package With An Air Cavity Above The Active Surface, For Micromechanical Applications
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A Wafer Level Chip Size Package With An Air Cavity Above The Active Surface, For Micromechanical Applications

机译：晶圆级芯片尺寸封装，在有源表面上方具有空腔，用于微机械应用

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摘要

While package developers struggle to keep pace with the shrinking I/O pitch of the latest ICs, another challenge is being added by a new wave of micro-electro-mechanical systems (MEMS). These devices combine standard IC circuitry with micro-moving silicon structures. MEMS are micron-sized structures such as beams, cantilevers, diaphragms, valves, plates, and switches that can function as tiny sensors and actuators. They are fabricated by integrated circuit (IC) manufacturing processes; that is, by bulk and surface micromachining. Like ICs, thousands of micromachines can be fabricated on a single wafer with supporting circuits integrated on the chip. They can be mass-produced in the millions at low prices, which is their main appeal. One of the biggest challenges is how MEMS chips will be packaged. While the devices share many of the same features of conventional ICs, they also present a host of differences. Since the whole point of MEMS is to utilize the micro-moving parts, the package must have feedthroughs from these structures to the environment, while protecting - but not impeding - the moving parts.
机译：封装开发人员努力跟上最新IC不断缩小的I / O步伐的同时，新一轮的微机电系统（MEMS）也带来了另一个挑战。这些器件将标准IC电路与微动硅结构结合在一起。 MEMS是微米级的结构，例如梁，悬臂，膜片，阀，板和开关，它们可以用作微型传感器和致动器。它们是通过集成电路（IC）制造工艺制造的；也就是说，通过整体和表面微加工。与IC一样，成千上万的微型机器可以在单个晶片上制造，并且支持电路集成在芯片上。它们可以以低廉的价格大量生产，这是它们的主要吸引力。最大的挑战之一是如何封装MEMS芯片。虽然这些器件具有许多常规IC的相同功能，但它们也存在许多差异。由于MEMS的全部目的是利用微动部件，因此封装必须具有从这些结构到环境的贯穿件，同时要保护而不是阻碍动部件。

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