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首页> 外文会议>37~(th) IMAPS Nordic Annual Conference 10-13 September 2000 Helsingor, Denmark >Properties of SBB flip for microsystems
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Properties of SBB flip for microsystems

机译：微系统的SBB翻转特性

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摘要

The Stud Bump Bonding (SBB) flip chip method has been evaluated on four different substrate types. A large test chip (1 x 1 cm) has been designed and it contains both daisy chained structures and structures which allow measuring of a single flip chip interconnection. In addition different chip sizes can be simulated. During the evaluation, the contact resistance has been measured after different exposures to harsh environments. Insulation resistance has been measured and test for silver migration has been performed. The SBB method has been used in the assembly of a complicated microsystem. This work showed that the SBB method is not only reliable and flexible with respect to pad layout, but the method can also be applied (with some modifications) in the assembly of a microsystem with odd topology and cavities inside. This paper will report partly on the reliability study performed and partly on the methods used for assembly of the microsystem.
机译：柱形凸块键合（SBB）倒装芯片方法已在四种不同的基板类型上进行了评估。设计了一个大型测试芯片（1 x 1 cm），它包含菊花链结构和允许测量单个倒装芯片互连的结构。另外，可以模拟不同的芯片尺寸。在评估过程中，已经在不同的恶劣环境下测量了接触电阻。已经测量了绝缘电阻并且已经进行了银迁移的测试。 SBB方法已用于组装复杂的微系统。这项工作表明，SBB方法不仅在焊盘布局方面可靠且灵活，而且该方法还可以（经过一些修改）应用于内部具有奇数个拓扑和空腔的微系统的组装。本文将部分报告进行的可靠性研究，部分报告用于组装微系统的方法。

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