首页> 外文会议>37th Annual Conference of the Ergonomics Society of Australia Inc., Nov 27-30, 2001, Sydney, NSW >Ergonomic Improvements for the Manufacture of Printed Circuit Assemblies Through Design Changes
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Ergonomic Improvements for the Manufacture of Printed Circuit Assemblies Through Design Changes

机译:通过设计变更对印刷电路板制造进行人机工程学改进

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The study aimed at reducing Printed Circuit Assembly (PCA) manufacturing problems, such as high production and customer rejects, occupational ill health and high labour content. Subjective assessments and direct observations were made in the manufacturing plant. The major problems were due to the Surface Mounted Technology Component Placement (SMTCP), the Manual Soldering (MS) and the Manual Cleaning (MC) processes. Previously, the SMTCP machines had difficulty in placing the Integrated Circuits (ICs) onto the pads due to the errors in the pad design, causing IC misalignment. The operators experienced difficulty in performing too much MS, which caused 13% component damage. The MC of the soldered areas of the PCAs caused headaches due to the smell of the solvent. Ergonomic recommendations were given and follow-up studies were conducted. The PCAs were redesigned to correct the pad design errors and to allow more components to be machine-soldered. This also reduced the labour content and the number of components being damaged during MS. Local suction chutes were installed to remove the MS fumes and solvent vapours. These interventions reduced the production rejects, improved productivity, improved occupational health and safety (OHS) and saved dollarUS 581,495 on rejection cost per annum.
机译:该研究旨在减少印刷电路组件(PCA)的制造问题,例如高产量和客户拒收,职业病危害健康以及高人工含量。在制造工厂进行了主观评估和直接观察。主要问题是由于表面安装技术组件放置(SMTCP),手动焊接(MS)和手动清洁(MC)工艺造成的。以前,由于焊盘设计中的错误,SMTCP机器很难将集成电路(IC)放置到焊盘上,从而导致IC失准。操作员在执行过多MS时遇到困难,这导致13%的组件损坏。 PCA焊接区域的MC由于溶剂的气味而引起头痛。提出了人体工程学建议,并进行了后续研究。重新设计了PCA,以纠正焊盘设计错误并允许对更多组件进行机器焊接。这也减少了劳动强度,并减少了MS期间损坏的组件数量。安装了本地吸料槽,以去除MS烟气和溶剂蒸气。这些干预措施减少了生产废品,提高了生产率,改善了职业健康与安全(OHS),每年节省了581,495美元的废品成本。

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