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Printed Organic Electronic Technology Platform Enabling the Design and Manufacturing of Integrated Circuits Towards Plastic Microprocessors

机译:印刷有机电子技术平台,使面向塑料微处理器的集成电路的设计和制造成为可能

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摘要

A dedicated printed electronics technology platform has been developed and implemented. The technology is devoted to the manufacturing of all-organic transistor devices with sub-micron feature size as multilayered structures, obtained through a sequential combination of deposition from solution and patterning steps through stamps. The manufacturing process includes fabrication of both rigid and flexible elastomeric stamps that are used in the development of fully printed devices and circuits on glass and plastic substrates. Moreover, to test the performance of printed electronic devices, a new compact simulation model has been developed taking into account the effect of contact resistance. Such a parameter acts as a key engineering parameter to enable access of polymer-based printed electronics to logic circuits running at relatively high speed, eventually associated with design solutions that allow achieving full rail-to-rail speed-up logic circuits and low power dissipation.
机译:一个专用的印刷电子技术平台已经开发和实施。该技术致力于制造具有亚微米特征尺寸的多层结构的全有机晶体管器件,该多层结构是通过从溶液的沉积和模压步骤的图案化顺序相结合而获得的。制造过程包括刚性和柔性弹性体印模的制造,这些印模用于在玻璃和塑料基板上开发完全印刷的设备和电路。此外,为了测试印刷电子设备的性能,已经开发了一种新的紧凑型仿真模型,其中考虑了接触电阻的影响。该参数充当关键工程参数,以使基于聚合物的印刷电子设备能够访问以相对较高的速度运行的逻辑电路,最终与设计解决方案相关联,从而实现了轨到轨的全速逻辑电路和低功耗。

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