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首页> 外文期刊>Journal of Electronic Packaging >Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
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Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

机译：具有硅通孔的嵌入式三维混合集成电路集成系统级封装，用于有机基板/印刷电路板中的光电互连

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摘要

A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate is designed and described. This system consists of a rigid PCB (or a substrate) with an embedded optical polymer waveguide, an embedded vertical cavity surface emitted laser (VCSEL), an embedded driver chip, an embedded serializer, an embedded photo-diode detector, an embedded tans-impedance amplifier (TIA), an embedded deserializer, embedded heat slugs, and a heat spreader. The bare VCSEL, driver chip, and serializer chip are 3D stacked and then attached on one end of the embedded optical polymer waveguide in the PCB. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are 3D stacked and then attached on the other end of the embedded optical polymer waveguide in PCB. The back-side of the driver or serializer and the TIA or deserializer chips is attached to a heat slug with or without a spreader. This novel structural design offers potential solutions for low-cost and high-performance semiconductor circuits with optical devices to realize wide-bandwidth and low-profile optoelectronic packaging for chip-to-chip optical interconnect applications. Optical, thermal management, and mechanical performances are demonstrated by simulations based on the optic theory, heat-transfer theory, and continuum mechanics.
机译：设计并描述了一种低成本（带有裸芯片）和高性能（光学，电气，热和机械性能）的光电系统，该系统嵌入到PCB（印刷电路板）或有机层压基板中。该系统由带有嵌入式光学聚合物波导的刚性PCB（或基板），嵌入式垂直腔表面发射激光器（VCSEL），嵌入式驱动器芯片，嵌入式串行器，嵌入式光电二极管检测器，嵌入式tans-阻抗放大器（TIA），嵌入式解串器，嵌入式散热块和散热器。将裸露的VCSEL，驱动器芯片和串行器芯片进行3D堆叠，然后将其附着在PCB中嵌入式光学聚合物波导的一端。类似地，将裸光电二极管检测器，TIA芯片和解串器芯片进行3D堆叠，然后将其附着在PCB中嵌入式光学聚合物波导的另一端。驱动器或串行器以及TIA或解串器芯片的背面连接到带有散热片或不带有散热片的散热块上。这种新颖的结构设计为带有光学器件的低成本和高性能半导体电路提供了潜在的解决方案，以实现用于芯片到芯片光学互连应用的宽带和薄型光电封装。光学，热管理和机械性能通过基于光学理论，传热理论和连续力学的模拟得到证明。

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