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首页> 外文会议>8th International conference on commercialization of micro and nano systems (COMS 2003) >IMPLICATIONS FOR COMMERCIALIZATION OF HIGH-PRECISION, HIGH-THROUGHPUT PARALLEL MICROASSEMBLY
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IMPLICATIONS FOR COMMERCIALIZATION OF HIGH-PRECISION, HIGH-THROUGHPUT PARALLEL MICROASSEMBLY

机译：高精确度，高通量的平行微组件商业化的意义

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Technical developments have made it possible and reasonable to consider microassembly based approaches for achieving complex device integration at the micro-scale. Currently, homogeneous as well as hybrid (or heterogeneous) devices have been demonstrated. The homogeneous devices are made from silicon components all fabricated with the same process. The hybrid devices are made from components from multiple microfabrication processes as well as non-MEM based micro-scale parts. These devices, and the processes and tools for their assembly, are impacting the commercialization landscape of microsystems. Understanding that impact by analyzing the technical improvements and the costs associated with these systems is important to the future direction of development and commercialization efforts. Specifically, the development of batch processed parallel assembly systems and tools pursued to increase throughput and lower assembly costs is considered. A sample assembled microsystem is analyzed to demonstrate that today this impact must be concentrated on unique technical aspects for high-value systems.
机译：技术的发展使得考虑基于微型装配的方法以实现微型规模的复杂设备集成成为可能和合理。当前，已经证明了同质以及混合（或异质）设备。均质器件由全部采用相同工艺制造的硅组件制成。混合设备由多个微加工过程中的组件以及非基于MEM的微型零件制成。这些设备及其组装过程和工具正在影响微系统的商业化前景。通过分析技术改进和与这些系统相关的成本来了解这种影响对开发和商业化工作的未来方向很重要。具体地，考虑了致力于增加产量和降低组装成本的批处理平行组装系统和工具的开发。分析了一个样本组装的微系统，以证明今天这种影响必须集中在高价值系统的独特技术方面。

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