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首页> 外文会议>Advanced fabrication technologies for microano optics and photonics VI >Photonic wire bonding: Connecting nanophotonic circuits across chip boundaries
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Photonic wire bonding: Connecting nanophotonic circuits across chip boundaries

机译：光子引线键合：跨芯片边界连接纳米光子电路

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摘要

Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with terabit/s data rates have come into reach. However, as on-chip integration density increases, a technological breakthrough is considered indispensable to cope with the associated off-chip connectivity challenges. Here we report on the concept of photonic wire bonding, where transparent waveguide wire bonds are used to bridge the gap between nanophotonic circuits located on different chips. We demonstrate fabrication of three-dimensional freeform photonic wire bonds, and we experimentally confirm their viability for broadband low-loss coupling and multi-terabit/s data transmission.
机译：在过去的几年中，光子集成已经取得了巨大的进步，并且已经达到了具有TB级数据速率的芯片级收发器系统。但是，随着片上集成密度的增加，为应对相关的片外连接性挑战，必不可少的技术突破。在这里，我们报道了光子丝键合的概念，其中透明的波导丝键合用于弥合位于不同芯片上的纳米光子电路之间的间隙。我们演示了三维自由形式的光子丝键合的制造，并通过实验证实了其在宽带低损耗耦合和多兆位/秒数据传输中的可行性。

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  • 来源
  • 会议地点 San Francisco CA(US)
  • 作者

    C. Koos; J. Leuthold; W. Freude; N. Lindenmann; S. Koeber; G. Balthasar; J. Hoffmann; T. Hoose; P. Huebner; D. Hillerkuss; R. Schmogrow;

  • 作者单位

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany,Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany,Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany,Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

    Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Photonic integration; two-photon polymerization; photonic wire bonding; silicon photonics; optical packaging; multi-chip integration; direct laser writing; 3D nanofabrication;

    机译：光子集成；双光子聚合；光子丝键合；硅光子学光学包装；多芯片集成；直接激光书写； 3D纳米加工;

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