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Thermal effects of moisture inducing delamination in light-emitting diode packages

机译：发光二极管封装中水分引起分层的热效应

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摘要

This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85℃/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.
机译：这项工作报告了发光二极管（LED）封装中的水分诱导分层及其对热特性的影响。对LED样品进行湿气预处理，然后进行热块测试。进行瞬态热测量以研究分层LED的热行为。从瞬态测量观察到热阻随分层程度的增加。从耦合场有限元分析计算出的热力学与显微证据非常吻合。计算出的湿机械应力随预处理时间的增加而增加。已经发现，热机械应力比湿机械应力在LED封装的分层发展中起着更重要的作用。发现在85℃/ 85RH条件下进行3个小时和6个小时的水分预处理对芯片和引线框之间的分层几乎没有影响。

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