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Low-cost Approach for Far-Infrared Sensor Arrays for Hot-Spot Detection in Automotive Night Vision Systems

机译:汽车夜视系统中用于热点检测的远红外传感器阵列的低成本方法

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Sensor data fusion of active near infrared (NIR) and passive far infrared (FIR) for reliable detection of vulnerable road users in future warning automotive night vision systems requires for low-cost, mid-resolution FIR sensor arrays for hot spot detection. We present a new cost efficient technology for FIR arrays adopting a volume proven integrated MEMS process for the production of a suspended thermo-diode array. In contrast to established bolometer production all steps of the process developed are fully semiconductor compatible as the sensor element formation is an integral part of the read out IC processing and does not require ASIC backend processing with dedicated equipment. Vacuum wafer-level packaging compatibility further reduces cost. In a first step the proposed process has been verified with small integrated FIR arrays consisting of 42×28 pixels. The FIR array development reported is part of the EU FP7 project ADOSE'.
机译:主动近红外(NIR)和被动远红外(FIR)的传感器数据融合,以在未来的警告汽车夜视系统中可靠地检测弱势道路使用者,需要低成本,中分辨率的FIR传感器阵列来进行热点检测。我们提出了一种新的具有成本效益的FIR阵列技术,该技术采用了经过验证的集成MEMS工艺来生产悬浮热二极管阵列。与既定的辐射热计生产相反,所开发过程的所有步骤都与半导体完全兼容,因为传感器元件的形成是读出IC处理的组成部分,并且不需要专用设备进行ASIC后端处理。真空晶圆级封装的兼容性进一步降低了成本。第一步,所提出的过程已由包含42×28像素的小型集成FIR阵列进行了验证。报道的FIR阵列开发是欧盟FP7项目ADOSE'的一部分。

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