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首页> 外文会议>Advanced microsystems for automotive applications 2009 : Smart systems for safety, sustainability, and comfort >Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)
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Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)

机译：用于轮胎压力监测的微型传感器节点（e-CUBES）

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摘要

Tire pressure monitoring systems (TPMS) are beneficial for the environment and road and passenger safety. Miniaturizing the TPMS allows sensing of additional parameters. This paper presents a miniaturized TPMS with a volume less than 1 cm~3, realised by 3D stacking and through-silicon via (TSV) technology. Suitable technologies with low electrical resistance and high bond strengths were evaluated for stacking the microcontroller, transceiver, pressure sensor and bulk acoustic resonator (BAR) in the TPMS. 60 μm deep W-filled TSVs with resistance 0.45 Ω and SnAg micro bumps with a bond strength of 53 MPa were used for stacking the transceiver to the microcontroller. TSVs through the whole wafer thickness with resistance 6 Ω were used for the pressure sensor. Au stud bumps were used for stacking the pressure sensor and BAR devices. The final TPMS stack was packaged in a moulded interconnect device (MID) package.
机译：轮胎压力监测系统（TPMS）对于环境以及道路和乘客安全都是有益的。小型化TPMS可以感应其他参数。本文提出了一种体积小于1 cm〜3的小型TPMS，它是通过3D堆叠和硅通孔（TSV）技术实现的。对低电阻和高粘结强度的合适技术进行了评估，以将微控制器，收发器，压力传感器和体声谐振器（BAR）堆叠在TPMS中。厚度为60μm的W填充TSV（电阻为0.45Ω）和SnAg微凸点（键合强度为53 MPa）用于将收发器堆叠到微控制器。贯穿整个晶片厚度的TSV电阻为6Ω，用于压力传感器。 Au柱形凸块用于堆叠压力传感器和BAR设备。最终的TPMS堆栈封装在模制互连设备（MID）封装中。

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