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首页> 外文会议>Advances in Electronic Packaging 2005 pt.A >Characterization of Electrical Failure Modes in Chip-On-Board Assemblies for Extreme Temperature Environments
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Characterization of Electrical Failure Modes in Chip-On-Board Assemblies for Extreme Temperature Environments

机译：极端温度环境下板载芯片组件中的电气故障模式的表征

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Future space missions to Mars and the outer planets will have to operate on the planet surface in temperatures that range from -200℃ to 40℃. These missions will require sensors, instruments and motors to operate for extended periods that exceed the duration of any planetary surface mission to date. Currently the Mars Science Laboratory rovers planned for 2009 will be required to survive a mission life of about 500 Martian sols. The Martian solar day is called a sol and is equal to 24 hours and 39 minutes of an Earth day. This extended mission requirement is beyond the reliability threshold of present electronic materials and interfaces such as those used on the Mars Exploration Rovers. The combination of correct materials, electrical interconnection and packaging design are critical to ensuring long life when the range between minimum and maximum temperatures approach or exceed 200℃. The Jet Propulsion Laboratory as part of the Mars Technology program is performing a series of designed experiments to determine the best electronic packaging materials that would survive 500 Martian sols in the temperature range of -120℃ to 85℃. This technology development is part of the preparation effort to design and build survivable electronics for the Mars Science Laboratory rovers and related future outer planet missions. This technology development program is called Temperature Cycle Resistant Electronics (TCRE) and is a 3 year design for electrical interface reliability activity. The experiment team assembled 27 different types of test vehicles which are the result of a full factorial designed experiment. There were 10 samples of each type assembled for statistical confidence to yield a total of 270 test vehicles. The basic test vehicle design consists of silicon die mounted to a substrate with gold wire bond electrical interconnects. Continuous electrical paths were designed into the substrate and the dice. The basic experiment consists of assembling three different types of substrates, three different types of die attach materials and three different types of over coat material. The test vehicles were subjected to 1500 thermal cycles (three times required mission life) from -120℃ to 85℃ over nine months. Open electrical circuits were observed over time due to material interactions over this temperature range that created electrical failures. This paper summarizes the failure results and identifies the material sets that survived this phase of the experiment for 1500 extreme temperature cycles.
机译：未来的火星及外行星太空飞行任务将必须在-200℃至40℃的温度范围内在行星表面上进行。这些任务将需要传感器，仪器和电动机进行更长时间的操作，超过了迄今为止任何行星表面任务的持续时间。目前，计划在2009年进行的火星科学实验室探测车必须能够存活约500个火星溶胶。火星的太阳日称为溶胶，相当于地球日的24小时39分钟。扩展的任务要求超出了当前的电子材料和接口（如在火星探索漫游者上使用的接口）的可靠性阈值。正确的材料，电气互连和包装设计的结合对于确保最低和最高温度范围接近或超过200℃时的长寿命至关重要。作为火星技术计划的一部分，喷气推进实验室正在进行一系列设计的实验，以确定在-120℃至85℃的温度范围内能在500种火星溶胶中存活的最佳电子包装材料。这项技术开发是为火星科学实验室漫游者及相关未来外行星任务设计和制造可生存电子设备的准备工作的一部分。此技术开发计划称为耐温度循环电子（TCRE），并且是针对电子接口可靠性活动的3年设计。实验团队组装了27种不同类型的测试车辆，这是经过完全析因设计的实验的结果。为了统计置信度，每种类型的10个样本组装在一起，总共产生了270个测试车辆。基本测试车辆设计包括通过金线键合电气互连安装到基板上的硅芯片。将连续的电气路径设计到基板和管芯中。基本实验包括组装三种不同类型的基板，三种不同类型的芯片连接材料和三种不同类型的外涂层材料。在9个月的时间内，测试车辆从-120℃到85℃经受了1500次热循环（要求任务寿命的三倍）。由于在此温度范围内发生的材料相互作用会导致电气故障，因此随着时间的推移观察到断路。本文总结了失败的结果，并确定了在此阶段的1500个极端温度循环中幸存下来的材料集。

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