• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Advances in Electronic Packaging 2005 pt.A >SYSTEM LEVEL THERMAL EVALUATION AND OPTIMIZATION OF AN AUTOMOTIVE MODULE INCORPORATING SEVERAL POWER PACKAGES
【24h】

SYSTEM LEVEL THERMAL EVALUATION AND OPTIMIZATION OF AN AUTOMOTIVE MODULE INCORPORATING SEVERAL POWER PACKAGES

机译：包含多个功率包的汽车模块的系统级热评估和优化

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The conjugate thermal performance of a microelectronics module incorporating several power packages and additional passive components in a custom environment is evaluated and further optimized using numerical simulation and experimental validation. The automotive industry deals on a daily basis with various package and module-level thermal issues when managing the routing of very high current. The study provides a better understanding of the strengths and weaknesses of the IC packaging incorporation into a system module level, for both present and future product development. The reference design is evaluated at a system level, and several improvements are identified to enhance the overall thermal performance. The main concern is the possibility of exceeding the thermal budget for the large system incorporating seven power packages with additional sources of heat dissipation in an enclosure, at an external ambient temperature of 85℃. The overall thermal impact of the metal trace dissipation, header heating and other passive components under various powered conditions is evaluated. An additional revised model includes additional passive components (32 LD SOIC and QFN packages) on the PCB, a modified harness extending ～ 30.4 cm outside the enclosure, and additional heating in the connectors. Several additional cases are investigated, varying the heat transfer coefficients outside the enclosure, at an ambient temperature of 85℃. The peak temperatures range from 121.4℃ to 126.4℃ and the corresponding junction-to-ambient thermal resistances (Rja) vary from 11.03℃/W to 12.5℃/W. The optimized numerical model approximates closely the empirical results (121-126℃ vs. 127.5℃), within 1-2%.
机译：在数值模拟环境和实验验证条件下，评估并进一步优化了在定制环境中结合了多个电源组件和其他无源元件的微电子模块的共轭热性能。在管理超大电流的布线时，汽车行业每天都会处理各种封装和模块级的散热问题。这项研究可以更好地了解将IC封装纳入系统模块级别的优势和劣势，无论是现在还是将来的产品开发。该参考设计在系统级别进行评估，并确定了一些改进措施以增强整体热性能。主要关注的问题是，在外部环境温度为85℃的情况下，包含七个电源包以及带有额外散热源的大型系统可能超出热预算。评估了在各种供电条件下金属走线，联管箱加热和其他无源组件的整体热影响。另一个经过修订的模型包括PCB上的其他无源组件（32 LD SOIC和QFN封装），改进的线束，其延伸到外壳外部〜30.4 cm，以及连接器中的额外热量。在环境温度为85℃的情况下，还研究了几种其他情况，它们改变了外壳外部的传热系数。峰值温度范围为121.4℃至126.4℃，相应的结至环境热阻（Rja）在11.03℃/ W至12.5℃/ W之间变化。优化的数值模型非常接近经验结果（121-126℃vs. 127.5℃），误差在1-2％之内。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号