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首页> 外文会议>Advances in Electronic Packaging 2005 pt.A >EFFICIENT COOLING OF MULTIPLE COMPONENTS IN A SHIELDED CIRCUIT PACK
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EFFICIENT COOLING OF MULTIPLE COMPONENTS IN A SHIELDED CIRCUIT PACK

机译：带屏蔽电路板中多个组件的高效冷却

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摘要

We describe technology in which multiple components inside a circuit pack shielded from electromagnetic interference (EMI) are efficiently cooled by individual heat sinks that protrude into an external airflow through openings in the lid of the shield. Compliant, electrically conductive gaskets are used to form a perimeter seal between the bases of the heat sinks and the lid of the enclosure. The gaskets accommodate variations in the heights of the components and allow solid-to-solid contact in the thermal-grease-filled interface between the components and their heat sinks without compromising EMI shielding. This technology provides efficient cooling because the heat sinks can be tailored to the thermal loads of the individual components. Moreover, a set of small heat sinks presents a lower impedance to the cooling airflow than the conventional configuration of fins covering the entire lid of an EMI shield. We have examined the implementation of this solution using ICEPAK® thermal modeling software and by experiment. It leads to acceptable thermal performance and lower impedance to air flow relative to the conventional approach. It also has important potential advantages in cost, weight, and ease of rework.
机译：我们描述了一种技术，在该技术中，电路板内部的多个被电磁干扰（EMI）屏蔽的组件通过各个散热器有效地冷却，这些散热器通过屏蔽盖的开口伸入外部气流中。顺应性的导电垫圈用于在散热器的底部和外壳的盖子之间形成周边密封。垫片可适应组件高度的变化，并在组件及其散热片之间的导热油脂填充界面中实现固-固接触，而不会影响EMI屏蔽。该技术可提供高效的冷却效果，因为散热器可根据各个组件的热负荷进行定制。此外，与覆盖EMI屏蔽罩整个盖子的传统散热片配置相比，一组小型散热器对冷却气流的阻抗更低。我们已经使用ICEPAK®热建模软件并通过实验检查了该解决方案的实施。与传统方法相比，它可以提供可接受的热性能并降低气流阻力。在成本，重量和易于返工方面也具有重要的潜在优势。

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