首页> 外文会议>Advances in Electronic Packaging 2005 pt.A >THERMAL MANAGEMENT OF VOIDS AND DELAMINATION IN TIMS
【24h】

THERMAL MANAGEMENT OF VOIDS AND DELAMINATION IN TIMS

机译:TIMS中空隙的热管理和分层

获取原文
获取原文并翻译 | 示例

摘要

The paper parametrically assesses the impact of the voids/delamination on the system thermal performance. Analysis are carried out numerically and validated against experimental data (thermal measurements and C-SAM images). Topics covered include the relationship between voids/delamination and TIMs' and heat spreader's effective thermal conductivity; sensitivity of the system thermal performance to void/delamination size and location; voids/delamination impact vs. on the chip power dissipation (uniform vs. non-uniform); comparison of TIM1 vs. TIM2 voids impact; and, finally, comparison of voids vs. delamination.
机译:本文从参数上评估了空隙/分层对系统热性能的影响。进行数字分析,并根据实验数据(热测量和C-SAM图像)进行验证。涵盖的主题包括空隙/分层与TIM和散热器的有效导热率之间的关系;系统热性能对空隙/分层尺寸和位置的敏感性;空洞/分层影响与芯片功耗的关系(均匀与不均匀); TIM1与TIM2的比较会影响空隙;最后,比较空隙与分层。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号