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首页> 外文会议>Advances in Electronic Packaging 2005 pt.A >EXPERIMENTAL VALIDATION OF CHANNELED WALL PASSIVE COOLING ENHANCEMENT
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EXPERIMENTAL VALIDATION OF CHANNELED WALL PASSIVE COOLING ENHANCEMENT

机译：通道式壁式被动冷却增强的实验验证

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摘要

Passive cooling enhancement with least additional mass of the material on the external wall can be a method for least energy thermal management for the consumer electronics. Previously, the channeled wall enhancement was found to have potentially four fold performance compare to the single wall in the analysis work, in which the enhancement factor with optimum shape with appropriate thermal conductivity of the material was presented. This method is assumed promising to help the energy efficient and quieter thermal design without sacrificing the valuable flat cosmetic surface of equipment. In this paper, flow regime in a channel composite wall is observed experimentally with PIV method as well as thermal resistance of the wall is observed in the same apparatus. These observation results are discussed with numerical analysis. The discussion is summarized with cooling enhancement factor based on the allowable temperature with comparing to the single wall. The result provides the strong evidence for the optimization on proposed analytic models.
机译：在外壁上具有最少额外质量的材料的被动冷却增强可以是用于消费电子产品的最少能量热管理的方法。以前，在分析工作中，发现通道壁的增强性能与单层壁相比可能具有四倍的性能，在这种分析中，提出了具有最佳形状和适当导热性的增强因子。假定此方法有望在不牺牲设备宝贵的平面装饰表面的情况下帮助实现节能高效且安静的散热设计。在本文中，通过PIV方法实验性地观察了通道复合壁的流动状态，并在同一设备中观察了壁的热阻。通过数值分析讨论了这些观察结果。通过与单个壁相比的允许温度，基于冷却增强因子来总结讨论。该结果为所提出的分析模型的优化提供了有力的证据。

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