SIMULATION OF STEADY STATE SURFACE TEMPERATURE RESPONSE OF A NOVEL MICRO LOOP HEAT PIPE TO VARIOUS HEAT LOADS

机译：新型微环热管对不同热负荷的稳态表面温度响应的模拟

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Numerical investigations have been performed to simulate a novel Micro Loop Heat Pipe (MLHP) under steady state conditions. For most electronics, the maximum working temperature is an important design factor; therefore an accurate estimation of this temperature is crucial. The model predicts the steady state temperature distribution at the surface of the heat source as a function of applied heat loads. This code builds upon a previous code developed by the authors, and utilizes a hybridizing of an Alternating Direction Implicit (ADI) Computational Fluid Dynamics (CFD) code and relevant thermodynamic equations. Using this simulation tool, the minimum required compensation chamber cavity has been calculated and checked for various operating temperature ranges. Additionally, the design of the MLHP has been improved by evaluating the effects of the geometric feature variations. Considering the fabrication limitations, some of the optimized geometry dimensions were found to be a groove wall thickness of 2μm, a groove width of 7μm, a wicking structure length of 500μm, and a vapor line width of 2mm.

机译：进行了数值研究，以模拟稳态条件下的新型微回路热管（MLHP）。对于大多数电子设备而言，最高工作温度是一个重要的设计因素。因此，准确估算此温度至关重要。该模型预测了热源表面的稳态温度分布与所施加的热负荷的关系。该代码建立在作者先前开发的代码的基础上，并采用了交替方向隐式（ADI）计算流体力学（CFD）代码和相关热力学方程的混合形式。使用该仿真工具，已计算出所需的最小补偿腔腔，并检查了各种工作温度范围。此外，通过评估几何特征变化的影响，改进了MLHP的设计。考虑到制造限制，发现一些优化的几何尺寸为：凹槽壁厚为2μm，凹槽宽度为7μm，芯吸结构长度为500μm，蒸气线宽度为2mm。

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《American Society of Mechanical Engineers(ASME) Summer Heat Transfer Conference(HT2005) vol.2; 20050717-22; San Francisco,CA(UA)》|2005年|P.633-640|共8页
会议地点 San FranciscoCA(UA)
作者
M. Ghajar; J. Darabi;
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作者单位

MEMS and Microsystems Laboratory Department of Mechanical Engineering University of South Carolina Columbia, SC 29208;

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正文语种 eng
中图分类热力工程理论;
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SIMULATION OF STEADY STATE SURFACE TEMPERATURE RESPONSE OF A NOVEL MICRO LOOP HEAT PIPE TO VARIOUS HEAT LOADS

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