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SIMULATION OF STEADY STATE SURFACE TEMPERATURE RESPONSE OF A NOVEL MICRO LOOP HEAT PIPE TO VARIOUS HEAT LOADS

机译：一种新型微环热管对各种热负荷的稳态表面温度响应的仿真

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Numerical investigations have been performed to simulate a novel Micro Loop Heat Pipe (MLHP) under steady state conditions. For most electronics, the maximum working temperature is an important design factor; therefore an accurate estimation of this temperature is crucial. The model predicts the steady state temperature distribution at the surface of the heat source as a function of applied heat loads. This code builds upon a previous code developed by the authors, and utilizes a hybridizing of an Alternating Direction Implicit (ADI) Computational Fluid Dynamics (CFD) code and relevant thermodynamic equations. Using this simulation tool, the minimum required compensation chamber cavity has been calculated and checked for various operating temperature ranges. Additionally, the design of the MLHP has been improved by evaluating the effects of the geometric feature variations. Considering the fabrication limitations, some of the optimized geometry dimensions were found to be a groove wall thickness of 2μm, a groove width of 7μm, a wicking structure length of 500μm, and a vapor line width of 2mm.

机译：已经进行了数值研究以在稳态条件下模拟新型微环热管（MLHP）。对于大多数电子设备，最大工作温度是重要的设计因素;因此，对该温度的精确估计至关重要。该模型以施加的热负荷的函数预测热源表面处的稳态温度分布。此代码在作者开发的先前代码上构建，并利用杂交的交替方向隐式（ADI）计算流体动力学（CFD）代码和相关的热力学方程。使用该仿真工具，已经计算了最低所需的补偿室腔并检查各种操作温度范围。另外，通过评估几何特征变化的效果来改善MLHP的设计。考虑到制造限制，发现一些优化的几何尺寸为2μm的凹槽壁厚，凹槽宽度为7μm，储存结构长度为500μm，蒸汽线宽度为2mm。

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《ASME Heat Transfer Conference》|2005年||共8页
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M. Ghajar; J. Darabi; American Society of Mechanical Engineers(ASME);
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中图分类热力工程理论;
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SIMULATION OF STEADY STATE SURFACE TEMPERATURE RESPONSE OF A NOVEL MICRO LOOP HEAT PIPE TO VARIOUS HEAT LOADS

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