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首页> 外文会议>Annual Symposium on Quantitative Nondestructive Evaluation; 19980719-24; Snowbird,UT(US) >ACOUSTIC EMISSION ANALYSIS OF CRACK FORMATION FOR LASER DRILLING OF ALUMINA (Al_2O_3) PLATES
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ACOUSTIC EMISSION ANALYSIS OF CRACK FORMATION FOR LASER DRILLING OF ALUMINA (Al_2O_3) PLATES

机译：铝合金（Al_2O_3）板激光钻孔裂纹形成的声发射分析

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摘要

Laser material processing is an enabling technology that has resulted in revolutionary product designs as well as novel manufacturing practices that have improved quality, productivity and flexibility in industry. Laser technology has changed precision drilling capabilities in the manufacturing industries. The highly focused beam of collimated light emits energy allowing the laser to drill accurate patterns of holes into extremely difficult-to-machine materials such as ceramics. With drill contact eliminated, a minimal heat affected zone (HAZ), and narrow kerf, ceramics can be drilled without distortion of the finished product. Although the use of lasers for drilling of structural ceramics has increased rapidly in recent years, the failures due to high thermal stresses and brittleness of the ceramic structures are still a major problem for manufacturing industries. Figure 1 shows a cracked alumina plate after laser drilling. Temperature gradients that occur during laser-material interaction result in strong thermal stresses in the heat affected zone. Due to the high thermal stresses and short process time (nanoseconds), many micro-cracks initiate and propagate through the ceramic. Sometimes, if thermal stress is high enough, the ceramic can fail. Previous theoretical studies have some models of the laser machining of ceramics. Gross et. al. investigated crack formation during laser drilling of silicon wafers.
机译：激光材料加工是一种促成的技术，它带来了革命性的产品设计以及新颖的制造方法，从而提高了行业的质量，生产率和灵活性。激光技术改变了制造业的精密钻孔能力。高度聚焦的准直光束会发出能量，从而使激光能够将孔的精确图案钻入极难加工的材料（例如陶瓷）中。消除了钻头接触，最小的热影响区（HAZ）和狭窄的切缝，可以在不变形最终产品的情况下钻出陶瓷。尽管近年来在结构陶瓷钻孔中使用激光的数量迅速增加，但是由于陶瓷结构的高热应力和脆性而导致的故障仍然是制造业的主要问题。图1显示了激光打孔后破裂的氧化铝板。激光与材料相互作用期间出现的温度梯度会在热影响区中产生强烈的热应力。由于高的热应力和较短的处理时间（纳秒），许多微裂纹会在陶瓷中引发并传播。有时，如果热应力足够高，陶瓷可能会失效。以前的理论研究有一些陶瓷激光加工的模型。格罗斯（Gross）等等研究了硅晶片激光钻孔过程中的裂纹形成。

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