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首页> 外文会议>Asia-Pacific Symposium on Engineering Plasticity and Its Applications(AEPA 2004) pt.2; 20040922-26; Shanghai(CN) >In situ Observation of The Micro-hole Healing Process
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In situ Observation of The Micro-hole Healing Process

机译：微孔修复过程的原位观察

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The Research on the mechanism of the internal crack healing in metals is an important basic work for improving metal quality and prolonging its lifetime, and it is very significant for developing the theory of materials. In the paper, in situ observation of the internal crack healing process on the section of pure copper sample under high temperature microscope, the fine structure of healed micro-holes are observed under scanning electron microscope. Observation results showed that the micro-voids of tens micron begin to be healed at the temperature of 750℃, and obviously healed at the temperature of 900℃. The fine structure of the healed micro-holes consists of some agglomerate particles at the scale of micrometer and much smaller particles on these agglomerate particles. According to the above observation, phenomenological model of micro-hole healing are presented, the healing process is passivating of hole edge on the observation section, shape regularization of micro hole; inner interface motion of micro hole in the matrix.
机译：对金属内部裂纹愈合机理的研究是提高金属质量，延长金属寿命的重要基础性工作，对发展材料理论具有重要意义。本文在高温显微镜下对纯铜试样截面的内部裂纹愈合过程进行了原位观察，在扫描电镜下观察了愈合后微孔的精细结构。观察结果表明，几十微米的微孔在750℃开始愈合，在900℃明显恢复。愈合的微孔的精细结构由一些微米级的团聚颗粒和这些团聚颗粒上的小得多的颗粒组成。根据以上观察，提出了微孔修复的现象学模型，修复过程为观察段孔边缘钝化，微孔形状规则化；基质中微孔的内部界面运动。

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