首页> 外文会议>Asian Pacific Conference on Fracture and Strength;APCFS; 20061122-25;20061122-25; Sanya(CN);Sanya(CN) >Distributions of Residual Stresses in Diffusion Bonding of Dissimilar Materials Intermetallics TiAl to Steel 40Cr and Effect of Interlayer
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Distributions of Residual Stresses in Diffusion Bonding of Dissimilar Materials Intermetallics TiAl to Steel 40Cr and Effect of Interlayer

机译:异种材料金属间化合物TiAl与40Cr钢扩散键合中的残余应力分布及中间层的影响

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Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with the smaller thermal expansion coefficient. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses. Concepts of the residual stress factor Rf and the thickness factor Tf were propounded. As selecting the interlayer, the interlayer with smaller |Rf| and Tf should be given precedence, and with a prerequisite of sufficient physical contact small thickness of the interlayer are finer.
机译:通过有限元计算模拟了异种材料金属间化合物TiAl与40Cr钢扩散键合中的残余应力分布。结果表明,破坏性残余应力出现在与基材粘结线相邻的微小区域,热膨胀系数较小。降低粘合温度和减少粘合时间有利于界面发丝的变质。提出了残余应力因子Rf和厚度因子Tf的概念。选择中间层时,| Rf |较小的中间层应当优先考虑Tf和Tf,并且在充分物理接触的前提下,中间层的厚度较小。

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