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首页> 外文会议>ASME(American Society of Mechanical Engineers) International Mechanical Engineering Congress: Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology; 20031115-20031121; Washington,DC; US >A NEW ROLE OF CFD SIMULATION IN THERMAL DESIGN OF COMPACT ELECTRONIC EQUIPMENT: APPLICATION OF BUILD-UP APPROACH TO THERMAL ANALYSIS OF A BENCHMARK MODEL
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A NEW ROLE OF CFD SIMULATION IN THERMAL DESIGN OF COMPACT ELECTRONIC EQUIPMENT: APPLICATION OF BUILD-UP APPROACH TO THERMAL ANALYSIS OF A BENCHMARK MODEL

机译：CFD模拟在紧凑型电子设备热设计中的新作用：建立方法在基准模型热分析中的应用

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摘要

Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based thermal design needs a new format that allows the packaging designer fast and versatile searches for better design options. The most serious factor that slows the CFD-based design is geometric complexity created by various components packed in a tight space of the system box. In a proposed methodology coined 'Build-up Approach (BUA)' CFD simulations are conducted in advance of the start of actual hardware design to develop a body of temperature distribution solutions for possible components placements in the system box. Two algorithms are introduced before and after CFD simulations. One defines the geometric parameters through singular value decomposition (SVD) of components placement patterns, and the other identifies important geometric parameters for thermal management through application of the Taguchi method. A case study was conducted on a simple hardware model (benchmark model) that embodies essential features of portable electronic equipment. The results proved the effectiveness of these algorithms in measuring the relative importance of geometric parameters, and weeding out unimportant geometric details contained in actual equipment.
机译：计算流体动力学（CFD）代码已证明其作为电子设备热设计工具的巨大潜力。但是，随着产品开发周期的缩短，基于CFD的热设计需要一种新的格式，该格式允许包装设计人员快速，通用地搜索更好的设计选项。减慢基于CFD的设计的最严重因素是由装在系统盒狭窄空间中的各种组件造成的几何复杂性。在提议的方法中，称为“构建方法（BUA）”的CFD模拟是在实际硬件设计开始之前进行的，以开发出温度分布解决方案的主体，以用于系统框中可能的组件放置。在CFD仿真之前和之后介绍了两种算法。一个通过零件放置图案的奇异值分解（SVD）定义几何参数，另一个通过应用Taguchi方法识别用于热管理的重要几何参数。对一个简单的硬件模型（基准模型）进行了案例研究，该模型体现了便携式电子设备的基本功能。结果证明了这些算法在测量几何参数的相对重要性以及清除实际设备中不重要的几何细节方面的有效性。

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