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THRESHOLD STRESS FOR CRACK-HEALING OF SILICON NITRIDE CERAMICS

机译:氮化硅陶瓷裂纹修复的阈值应力

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摘要

Si_3N_4/SiC composite ceramics were hot-pressed in order to investigate the crack-healing behavior under stress. Semi-elliptical surface cracks of 100 μm in surface length were introduced on each specimen. The pre-cracked specimens were crack-healed under cyclic or constant bending stress of 5 H_z at healing temperatures of 1000° and 1200℃ and the resultant bending strength and fatigue strength were studied. The threshold stress for crack-healing, below which the pre-cracked specimens recovered their bending strength, was investigated. The mechanisms of crack-healing in Si_3N_4/SiC under stress were also discussed.
机译:热压Si_3N_4 / SiC复合陶瓷是为了研究应力下的裂纹修复行为。在每个样品上引入表面长度为100μm的半椭圆形表面裂纹。将预开裂的试样在5 H_z的周期性或恒定弯曲应力下于1000°和1200℃的恢复温度下进行裂纹修复,并研究由此产生的弯曲强度和疲劳强度。研究了裂纹修复的阈值应力,低于该阈值应力,预裂纹样品恢复了其弯曲强度。讨论了Si_3N_4 / SiC在应力作用下的裂纹修复机理。

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