Department of Mechanical, Materials and Aerospace Engineering University of Central Florida, Orlando, Florida 32816, USA;
Department of Mechanical, Materials and Aerospace Engineering University of Central Florida, Orlando, Florida 32816, USA;
Department of Mechanical, Materials and Aerospace Engineering University of Central Florida, Orlando, Florida 32816, USA;
Department of Mechanical, Materials and Aerospace Engineering University of Central Florida, Orlando, Florida 32816, USA;
magnesium matrix composite; nanoparticle reinforcement; minimum chip thickness; cutting force model;
机译:SiC纳米颗粒增强镁纳米复合材料微铣削加工性能的实验研究
机译:考虑簇效应的SiC纳米粒子增强镁基复合材料加工参数的因子分析
机译:超声振动制备SiC纳米颗粒增强镁基复合材料的组织和力学性能
机译:SiC纳米粒子对微铣镁基复合材料切割力影响的研究
机译:SiC / SiC陶瓷基复合材料损伤机制的多规模研究
机译:SiC纳米颗粒和第二相协同增强镁基复合材料的热变形行为和加工图
机译:杂交增强镁基复合材料(Mg / SiC / GNPS):钻探调查
机译:强制等温化学气相渗透siC / siC陶瓷基复合材料的研究。总结报告。