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首页> 外文会议>Conference on Emerging Lithographic Technologies Ⅴ Feb 27-Mar 1, 2001, Santa Clara, USA >Micromachining using a focused MeV proton beam for the production of high precision 3D microstructures with vertical sidewalls of high orthogonality
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Micromachining using a focused MeV proton beam for the production of high precision 3D microstructures with vertical sidewalls of high orthogonality

机译：使用聚焦的MeV质子束进行微加工，以生产具有高正交性的垂直侧壁的高精度3D微结构

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The production of high aspect ratio microstructures requires a lithographic technique capable of producing microstructures with vertical sidewalls. There are few techniques (eg proton beam micromachining, LIGA and Stereolithoghaphy) capable of producing high aspect ratio microstructures at sub-micron dimensions. In Proton Beam Micromachining (PBM), a high energy (eg 2 MeV) proton beam is focused to a sub-micron spot size and scanned over a resist material (eg SU-8 and PMMA). When a proton beam interacts with matter it follows an almost straight path, the depth of which is dependent on the proton beam energy. These features enable the production of multilevel microstructures with vertical sidewalls of high orthogonality. Proton beam micromachining is a fast direct write lithographic technique; in a few seconds a complicated pattern in an area of 400 X 400 μm~2 can be exposed down to a depth of 150 μm. These features make proton beam micromachining a technique of high potential for the production of high-aspect-ratio-structures at a much lower total cost than the LIGA process, which requires a synchrotron radiation source and precision masks. Research is currently under way to improve the process that employs the SU-8 negative photo-resist as a mold to electroplate Ni. Experiments have shown that post-bake and curing steps are not required in this SU-8 process, reducing the effects of cracking and internal stress in the resist. Plated Ni structures can be easily produced which are high quality negative copies of the SU-8 produced microstructures.
机译：高长宽比的微结构的生产需要能够产生具有垂直侧壁的微结构的光刻技术。很少有技术（例如质子束微加工，LIGA和立体定向）能够产生亚微米尺寸的高长宽比的微结构。在质子束微加工（PBM）中，高能（例如2 MeV）质子束聚焦到亚微米的光斑尺寸，并在抗蚀剂材料（例如SU-8和PMMA）上扫描。当质子束与物质相互作用时，它遵循一条几乎笔直的路径，其深度取决于质子束的能量。这些特征使得能够生产具有高正交性的垂直侧壁的多层微结构。质子束微加工是一种快速的直接写入光刻技术。在几秒钟内，可以将400 X 400μm〜2区域中的复杂图案暴露到150μm的深度。这些特征使质子束微加工技术具有很高的潜力，可以以比LIGA工艺更低的总成本生产高纵横比结构，而LIGA工艺需要同步辐射源和精密掩模。目前正在进行改善以SU-8负型光刻胶作为电镀Ni模具的工艺的研究。实验表明，在此SU-8工艺中不需要后烘烤和固化步骤，从而减少了抗蚀剂中裂纹和内部应力的影响。镀镍结构很容易生产，是SU-8生产的微结构的高质量负片。

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