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首页> 外文会议>Conference on high energy/average power lasers and intense beam applications III; 20090126-27; San Jose, CA(US) >Advanced-UV excimer laser processing
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Advanced-UV excimer laser processing

机译：先进的紫外准分子激光加工

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摘要

High energy excimer lasers lend maximum flexibility to laser microprocessing, since virtually every material is amenable to accurate, high resolution material ablation without subsequent post treatment. Due to the UV photons provided with no up-conversion required as direct output by excimer lasers, output powers of many hundred watts are easily achievable and are key to high throughput, and up-scaling capability of manufacturing processes. In particular, the large flat-top excimer laser profile is well-suited for most efficient parallel processing of two and three dimensional microstructures. Compact micromachining concepts particularly suited for material ablation and surface activation will be introduced.
机译：高能量准分子激光器为激光微处理提供了最大的灵活性，因为实际上每种材料都可以进行精确，高分辨率的材料烧蚀，而无需后续的后处理。由于准分子激光器直接输出不需要上转换的UV光子，因此很容易获得数百瓦的输出功率，这对于高通量和制造工艺的放大能力至关重要。特别地，大的平顶准分子激光轮廓非常适合二维和三维微观结构的最有效并行处理。将介绍特别适合材料烧蚀和表面活化的紧凑型微加工概念。

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