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首页> 外文会议>Conference on MEMS Reliability for Critical Applications 20 September 2000 Santa Clara, USA >Characterization of Kovar-Pyrex anodically bonded samples - a new packaging approach for MEMS devices
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Characterization of Kovar-Pyrex anodically bonded samples - a new packaging approach for MEMS devices

机译：表征Kovar-Pyrex阳极键合样品-MEMS器件的新封装方法

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摘要

The ability to anodically bond Kovar to Pyrex 7740 significantly expands the packaging approaches available for MEMS devices. This technique greatly simplifies and reliably interconnects microproulsion MEMS components (thrusters, values) with the attached propellant system. Experiemtnal bonds of Kovar plates and fixtures have been made to numerous Pyrex samples in order to investigate the strength and failure modes of these bonds. An emphasis on experimentally bonding at low temperatures (approx 200 deg C) using large voltages (< 2000 V) was also a important parameter of this research and a current microvalue project at JPL. Bond strength measurements have been made using calibrated pull and burst tests with their results being comparable to typcial silicon to Pyrex anodic bonds. Detailed bonding conditions for the tested sampels have been included in this manuscript to aid the MEMS designer in using this approach to satisfy their packaging needs.
机译：将Kovar与Pyrex 7740阳极结合的能力极大地扩展了MEMS器件可用的封装方法。这项技术极大地简化了微冲力MEMS组件（推进器，数值）并将其与所连接的推进剂系统可靠地互连。为了研究这些粘结的强度和破坏方式，已经对许多派热克斯样品进行了Kovar板和夹具的实验粘结。强调在低温下（约200摄氏度）使用大电压（<2000 V）进行实验键合也是该研究的重要参数，也是JPL当前的微价值项目。粘结强度的测量已经使用校准的拉力和爆裂测试进行，其结果可与典型的硅到派热克斯阳极粘结相媲美。该手稿中包含了详细的测试样品粘合条件，以帮助MEMS设计人员使用这种方法来满足其包装需求。

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