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首页> 外文会议>Conference on Optical and Infrared Detectors for Astronomy; 20040621-20040622; Glasgow; GB >Mosaic Packaging for Large - Format Infrared Devices
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Mosaic Packaging for Large - Format Infrared Devices

机译：大型红外设备的马赛克包装

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摘要

The desire for larger and larger format arrays for astronomical observatories - both ground and space based - has fueled the development of very large focal plane array (FPA) packaging technology. This has generated new designs and the use of new materials suitable for high reliability and long thermal cycle performance when exposed to operating temperatures from ambient to below 10 Kelvin. We present the design and performance of a series of package designs meeting these requirements evolving from single large mega-pixel arrays through the multiple detector arrays utilizing 4-side butting. This butting arrangement permits future detector arrays of significant size of approaching a meter on a side for infrared astronomy. This packaging technology and the use of thermally compatible materials enable the large format packaging of all detector and Readout Integrated Chip (ROIC) combinations in current production. Current and future applications include the Mid-Infrared Instrument (MIRI) detector for the James Webb Space Telescope (JWST) mission, the 16 VIRGO detector focal planes for the Visible and Infrared Survey Telescope for Astronomy (VISTA) IR survey telescope and future applications such as the Supernova Acceleration Probe (SNAP) mission.
机译：对于天文观测站越来越大的阵列（基于地面和空间）的需求推动了超大焦平面阵列（FPA）包装技术的发展。当暴露于从环境温度到低于10开尔文的工作温度时，这产生了新的设计并使用了适合于高可靠性和长热循环性能的新材料。我们介绍了满足这些要求的一系列封装设计的设计和性能，这些封装设计从单个大型兆像素阵列发展到利用4侧对接的多个检测器阵列。这种对接布置允许将来的探测器阵列具有很大的尺寸，其在一侧接近于红外天文仪。这种封装技术和热兼容材料的使用使当前生产中所有检测器和读出集成芯片（ROIC）组合的大幅面封装成为可能。当前和未来的应用包括用于詹姆斯·韦伯太空望远镜（JWST）任务的中红外仪器（MIRI）探测器，用于天文学的可见和红外勘测望远镜（VISTA）的16个VIRGO探测器焦平面以及未来的应用，例如作为超新星加速探测器（SNAP）的任务。

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