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首页> 外文会议>Conference on Optical Microlithography XV Pt.2, Mar 5-8, 2002, Santa Clara, USA >Bottom Anti-Reflective Coating Processing Techniques for Via-First Dual Damascene Processes
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Bottom Anti-Reflective Coating Processing Techniques for Via-First Dual Damascene Processes

机译：通孔-第一双镶嵌工艺的底部抗反射涂层处理技术

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摘要

As dual damascene process integration continues, Bottom Anti-Reflective Coating (BARC) processing information for partial and full via fill for via-first dual damascene has been an increasing concern. To fill this need a screening design of experiment was used to discover the main factors that would give increased fill and reduce iso-dense bias for both fill and top coverage. This DOE incorporated typical coat and bake module process parameters, such as acceleration, spin speed, and spin time for the dispense, spread and casting steps, and a two stage bake for the bake module. The process steps that were found to affect via fill and iso-dense bias for via fill and top coverage were then used in multi-level process characterizations and are presented here. Multiple viscosities were also tested in these designs to bracket partial via fill processing. Via fill and bias results for via fill and top coverage will be presented for contact vias that have diameters from 300nm to 160nm that range in pitch ratios of dense (1:1) to isolated (1:5).
机译：随着双大马士革工艺集成的持续发展，底部抗反射涂层（BARC）处理部分通孔和全孔先填充双大马士革的信息已成为人们日益关注的问题。为了满足这一需求，采用了一项实验筛选设计来发现主要因素，这些因素将增加填充量并减少填充和顶部覆盖的等密度偏差。该DOE结合了典型的涂布和烘烤模块工艺参数，例如分配，涂布和浇铸步骤的加速度，旋转速度和旋转时间，以及烘烤模块的两阶段烘烤。被发现会影响通孔填充和等密度偏置的通孔填充和顶部覆盖率的工艺步骤随后用于多级工艺表征中，并在此处进行介绍。在这些设计中还测试了多种粘度，以将部分通孔填充处理括起来。对于直径从300nm到160nm范围在密集（1：1）到隔离（1：5）之间的接触通孔，将显示通孔填充和顶部覆盖的通孔填充和偏置结果。

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