首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics III; 20040126-20040129; San Jose,CA; US >Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO_2 laser
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Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO_2 laser

机译:使用增强的峰值功率平面波导CO_2激光器对树脂涂覆的铜基板进行单脉冲微孔钻孔

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CO_2 laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm~(-2) for 5 μm and 1500 Jcm~(-2) for 12 μm copper thickness, using laser pulses in the 10 μs and 20 μs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.
机译:已经研究了在不同注量水平下对层压电路板的树脂涂层铜(RCC)层进行的CO_2激光钻孔。发现铜层钻孔的阈值通量分别为10μs和20μsFWHM,对于5μm的铜厚度为570 Jcm〜(-2),对于12μm的铜厚度为1500 Jcm〜(-2)。发现树脂层的底切主要取决于脉冲尾部中多余能量的量。已经研究了减少脉冲衰减时间的方法,使直径较小的穿透孔接近阈值,这将有助于控制RCC中的钻孔。高速摄影已用于验证后处理分析的结果。

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