• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics Jan 21-24, 2002 San Jose, USA >Pulsed Laser Ablation of IC Packages for the Device Failure Analyses
【24h】

Pulsed Laser Ablation of IC Packages for the Device Failure Analyses

机译：IC封装的脉冲激光烧蚀，用于设备故障分析

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Pulsed laser ablation of mold compounds for IC packaging in air and with steam assistance is investigated. It is applied to decap IC packages and expose computer CPU dies for the device failure analyses. Compared with chemical decapping, the laser ablation has advantages of being fast speed, non-contact & dry processing. Laser ablation with the steam assistance results in higher ablation rate and wider ablated crater with much smoother surface morphology. It implies that the steam assisted laser ablation can achieve a faster and better quality laser processing. Audible acoustic wave and plasma optical signal diagnostics are also carried out to have a better understanding of the mechanisms behind. Light wavelength and laser fluence applied in the decapping are two important parameters. The 532 nm Nd:YAG laser decapping at a low laser fluence can achieve a large decapping area with a fine ablation profile. IC packages decapped by the laser ablation show good quality for the device failure analyses.
机译：研究了在空气中和在蒸汽辅助下用于IC封装的模塑化合物的脉冲激光烧蚀。它用于对IC封装进行封盖，并公开计算机CPU裸片以进行设备故障分析。与化学脱盖相比，激光烧蚀具有速度快，非接触式和干式加工的优点。具有蒸汽辅助作用的激光烧蚀导致较高的烧蚀率和更宽的烧蚀坑，表面形态更加平滑。这意味着蒸汽辅助激光烧蚀可以实现更快，更好质量的激光加工。还进行了声波和等离子体光信号诊断，以更好地了解其背后的机制。开盖中使用的光波长和激光能量密度是两个重要参数。以低激光通量进行532 nm Nd：YAG激光去盖罩可以实现大的去盖罩面积，并具有良好的烧蚀轮廓。通过激光烧蚀脱盖的IC封装对于器件故障分析显示出良好的质量。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号