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首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics Jan 21-24, 2002 San Jose, USA >Overview and Future Prospects of the Use of Lasers for Packaging by Microelectronics and Photonics Industry in Japan
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Overview and Future Prospects of the Use of Lasers for Packaging by Microelectronics and Photonics Industry in Japan

机译：日本微电子和光子行业在包装中使用激光的概述和未来展望

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This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.
机译：本文介绍了日本微电子和光子行业使用激光进行包装的概述和未来前景。已经开发出各种激光器和材料处理技术，并将其用于制造电子和光子设备，以满足对高性能，轻便，低能耗移动数字消费电子，宽带光纤通信，低排放和燃料的强烈需求。高效，易于操纵的智能汽车等。本文强调固态激光器是用于包装高级紧凑型设备的便捷且通用的光源，这些紧凑型设备具有敏感的无源或有源部件，且部件尺寸小。在电子和光子设备中使用固态激光器的一些代表性材料加工应用包括：LCD的不透明和清晰的缺陷修复，功能模块的修整，光子设备的光学特性的微调，各种高通孔的形成密度互连电路，非晶太阳能电池的激光图案化以及光学组件，微型继电器和锂离子电池等电子组件的高精度激光焊接。高功率超短脉冲固态激光器的最新进展似乎正在迅速提高其处理能力，例如用于微调滤光片等。

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