Microscale Bending of Brittle Materials using Pulsed and CW Lasers

机译：使用脉冲和连续波激光器对脆性材料进行微尺度弯曲

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This work demonstrated using pulsed and CW lasers for microscale bending of brittle materials, including glass, ceramic, and silicon. Based on the absorption characteristics of these materials, different types of lasers were used for achieving bending. Experimental studies were conducted to find out relations between bending angles and laser operation parameters.

机译：这项工作证明了使用脉冲和连续波激光器对包括玻璃，陶瓷和硅在内的脆性材料进行微观弯曲。基于这些材料的吸收特性，使用了不同类型的激光来实现弯曲。进行实验研究以找出弯曲角度与激光操作参数之间的关系。

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来源
《Conference on Photon Processing in Microelectronics and Photonics Jan 21-24, 2002 San Jose, USA》|2002年|p.291-296|共6页
会议地点 San Jose CA(US)
作者
Richard X. Zhang; Xianfan Xu;
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作者单位

School of Mechanical Engineering Purdue University West Lafayette, IN 47907;

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会议组织
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词
laser bending; brittle materials; thermal stress; pulsed laser; CW laser;

机译：激光弯曲;脆性材料;热应力;脉冲激光;连续波激光;

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专利

1. High Precision Microscale Bending by Pulsed and CW Lasers [J] . X. Richard Zhang, Xianfan Xu Journal of manufacturing science and engineering: Transactions of the ASME . 2003,第3期

机译：脉冲和连续激光的高精度微弯
2. A Diode-Laser-System for Laser-Assisted Bending of Brittle Materials [J] . F.Bammer, D.Schu?cker, T.Schumi, Advances in Optical Technologies . 2011,第2期

机译：用于脆性材料激光辅助弯曲的二极管激光系统
3. Experimental and numerical studies on microscale bending of stainless steel with pulsed laser [J] . G. Chen, X. Xu, C. C. Poon, Journal of Applied Mechanics: Transactions of the ASME . 1999,第3期

机译：脉冲激光不锈钢微尺度弯曲的实验与数值研究
4. Microscale Bending of Brittle Materials using Pulsed and CW Lasers [C] . Richard X. Zhang, Xianfan Xu Society of Photo-optical Instrumentation Engineers Europe Conference on Photon Processing in Microelectronics and Photonics . 2002

机译：使用脉冲和CW激光器的微观弯曲脆性材料
5. Photoelectric field emission from needle cathodes induced by CW and pulsed lasers. [D] . Hernandez Garcia, Carlos. 2001

机译：连续波和脉冲激光从针状阴极发出的电场发射。
6. In-situ X-ray Differential Micro-tomography for Investigation of Water-weakening in Quasi-brittle Materials Subjected to Four-point Bending [O] . Petr Koudelka, Tomas Fila, Vaclav Rada, 2020

机译：原位X射线微分断层扫描技术研究脆性材料在四点弯曲下的水弱化
7. Cleaving Process of Brittle Materials with Pulsed YAG Laser: Thermal Stress Analysis in Cleaving Process of Silicon Wafer [O] . 山田, 啓司, 西岡, 真吾, 細川, 晃, 2003

机译：脉冲YaG激光切割脆性材料的过程：硅片切割过程中的热应力分析
8. Laser Exposures in the Maculas of Human Volunteers. I. CW HeNe, CW Argon, Pulsed Ruby Laser Measurements [R] . Wolbarsht, M. L., Landers, M. B. 1972

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Microscale Bending of Brittle Materials using Pulsed and CW Lasers

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