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Thin Film Packaging Reinforcement for Overmolded MEMS

机译：包覆成型MEMS的薄膜包装增强

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摘要

A Thin Film packaging (TFP) technology has been developed. It is mainly used as a protection for MEMSrnagainst degradation which can occur during back end processes: TFP is strong enough to endure thernmechanical constraints due to grinding, handling and protects the device from water during the sawing step.rnOur TFP process is also compatible with under bump metallization, balling and flip chip processes. This paperrndeals with process improvement for compatibility with molding. The thermo-mechanical constraints due to thernstandard overmolding step are very challenging for the thin caps of TFP that need to be reinforced. Twornprocesses have been developed at wafer level with two materials. 200μm and 500μm wide cavities with TFPrnwere reinforced with these processes. Two overmolding conditions were tested: 75 bar and 100 bar at 185°C. Inrnthe same run, BAW resonators with TFP and one type of reinforcement were overmolded at 100 bar and showsrngood RF performance. Thus, we have shown that with TFP protection the RF MEMS are compatible with lowrncost packaging solutions used for ICs.
机译：已经开发了薄膜包装（TFP）技术。它主要用于防止后端过程中发生的MEMS退化：TFP足够坚固，可以承受由于磨削，处理而产生的机械约束，并在锯切步骤中保护设备免受水侵害。凸点金属化，球化和倒装芯片工艺。本文致力于改进工艺以与成型件相容。对于需要加固的TFP薄盖，由于标准的包覆成型步骤而导致的热机械约束非常具有挑战性。已经在晶圆级开发了两种材料的两种工艺。通过这些工艺增强了带有TFPrn的200μm和500μm宽腔。测试了两个包覆成型条件：在185°C下为75 bar和100 bar。在同一轮次中，带有TFP和一种增强材料的BAW谐振器在100 bar下被包覆成型，并显示出良好的RF性能。因此，我们证明了具有TFP保护功能的RF MEMS与用于IC的低成本封装解决方案兼容。

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  • 来源
    《Device packaging 2010》|2010年|p.1-4|共4页
  • 会议地点 Scottsdale/Fountain Hills AZ(US)
  • 作者

    C. Gillot; J.-L. Pornin; C. Billard; E. Lagoutte; M. Pellat; G. Parat; N. Sillon;

  • 作者单位

    CEA, LETI, MINATEC, 17 rue des Martyrs, F38054 Grenoble, France;

    CEA, LETI, MINATEC, 17 rue des Martyrs, F38054 Grenoble, France;

    CEA, LETI, MINATEC, 17 rue des Martyrs, F38054 Grenoble, France;

    CEA, LETI, MINATEC, 17 rue des Martyrs, F38054 Grenoble, France;

    CEA, LETI, MINATEC, 17 rue des Martyrs, F38054 Grenoble, France;

    CEA, LETI, MINATEC, 17 rue des Martyrs, F38054 Grenoble, France;

    CEA, LETI, MINATEC, 17 rue des Martyrs, F38054 Grenoble, France;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 制造工艺;
  • 关键词

    thin film packaging; MEMS; overmolding; reinforcement;

    机译：薄膜包装； MEMS ;;包覆成型；加强;

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